Wallboard Profiling System

Key features

• Complete turnkey industrially designed hardware & software system for wallboard production
• User-friendly software with clear graphical overview on a single screen
• Detailed continuous board quality monitoring
• Real-time detection of bubbles, blisters and clumps
• Failure identification function tracked in database
• Automatic live rejection of defective boards
• Database LogViewer for historical and quality analysis
• High resolution thermal imager for accurate infrared images
• Complete hardware system configured for harsh environments
• Network connectivity for remote communication
• Onsite TIP900 system configuration and training of your operators
• Accuracy: ±2% of measured value or ±2 ºC (4 ºF), whichever is greater
• Temperature Range: 350 ºC max. (662 ºF max.)
• Ambient Temperature: 0 to 50 °C (32 to 122 °F)

Product overview

The TIP900 system is a comprehensive thermal imaging and noncontact profiling system designed to supervise the temperature of wallboards coming out of the oven. It uses an infrared thermal imager to continuously scan the entire board surface temperatures and allows the detection in real time of moisture and density variations inside each board.

The powerful TIP900 software provides sophisticated data integration, visualization and event analysis, and offers users a complete solution of real-time monitoring, detection and traceability. It also analyzes and provides optimal oven dryer profile balance.

The detailed wallboard quality maps, the historical temperature trend charts and the images can be seen locally at the operator workstation or remotely. All data is stored in the LogViewer database for complete process visibility and long term traceability.